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Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

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Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

Name: Dense And NonPorous Alumina Ceramic Ring Component For Electronics And Semiconductors
Brand: Dayoo
Price: 1 USD

Place of Origin : Made in China，Zhejiang，Jinhua

Brand Name : Dayoo

MOQ : as negotiated and agreed

Price : as negotiated and agreed

Delivery Time : depend on the actual product

Payment Terms : FOB

Shape : Customizable

Wear Resistance : High

Thermal Expansion Coefficient : 8.2 x 10^-6 /°C

Alumina Content : 95%

Compressive Strength : 2000Mpa

Dielectric Loss : 0.0002

Precision Tolerance : High

Low Thermal Expansion : Excellent

Elastic Modulus : 380 GPa

Materials : 92% alumina powder

Dielectric Strength : 15 KV/mm

Mechanical Strength : High

Melting Point : 2,072°C

Type : ceramic ball

Hardness : 9 Mohs

Packaging Details : Carton，Wooden Case

Certification : GB/T 19001-2016/ISO 9001:2015

Model Number : depend on the actual product

Supply Ability : Factory

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Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

This high-precision alumina ceramic ring component (purity ≥95%) is manufactured using isostatic pressing technology, featuring an 乳白色瓷质 luster with a precision structure consisting of an annular body + 6 sets of symmetrical notches + 6 positioning round holes. The product surface exhibits dense, non-porous characteristics after sintering at 1600°C, with rounded edge treatment ensuring installation safety, suitable for core transmission systems of automation equipment.

[Core Applications]

Precision Machinery: High-speed motor bearing retainers, servo system positioning rings
Electronics & Semiconductors: IC test fixture insulation bases, wafer carrier positioning components
New Energy: Lithium battery pole piece cutting dies, hydrogen fuel cell bipolar plate frames
Medical Devices: Minimally invasive surgical instrument guide sleeves, dental implant abutment connectors

[Performance Advantages]

✅ Physical Properties: Hardness HRA90-92 (comparable to sapphire), flexural strength ≥350MPa
✅ Weather Resistance: Operating temperature -200°C~1600°C, thermal expansion coefficient 6.8×10⁻⁶/°C
✅ Chemical Stability: Resistant to strong acids and alkalis (except hydrofluoric acid), insulation resistance >10¹⁴Ω
✅ Precision Control: Dimensional tolerance ±0.01mm, surface roughness Ra0.4μm

[Specification Parameter Table]

Parameter Item	Index Value	Test Standard
Outer Diameter	φ50±0.02mm	GB/T 2848-2015
Inner Diameter	φ20±0.01mm	GB/T 2848-2015
Thickness	8±0.01mm	GB/T 2848-2015
Number of Notches	6 sets symmetric	Custom Drawing
Positioning Hole Diameter	φ4±0.01mm	GB/T 2848-2015
Density	3.85g/cm³	GB/T 25995-2010

[Production Process]

Raw material proportioning → Ball milling → Spray granulation → Isostatic pressing → Degreasing → High-temperature sintering → CNC precision machining → Ultrasonic cleaning → Laser inspection → Vacuum packaging

[Usage Instructions]

Use special ceramic clamping tools during installation to avoid hard force collision
Control temperature changes in working environment to ≤5℃/min
Clean with anhydrous ethanol ultrasonic cleaning (power ≤40kHz)
Do not store with metal hard objects; use anti-static packaging boxes

[After-Sales Service]

✓ Free replacement for non-human damage within 1-year warranty period
✓ Customization with drawings
✓ Third-party material testing reports

[FAQ]

Q: Does the product support high-temperature and high-pressure sterilization?
A: Can withstand 134℃ high-pressure steam sterilization (complies with ISO 17665 standard)

Q: Is RoHS environmental certification available?
A: The entire product series has passed RoHS 2.0 ten-item testing (Report No.: ENV20230512007)

Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors

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Dense And Non-Porous Alumina Ceramic Ring Component For Electronics And Semiconductors